Diffusion, Oxidation & Annealing Equipment

1. Provides precise high-temperature control for uniform oxide growth and reliable annealing results.

2. Supports both dry and wet oxidation processes to form high-quality silicon dioxide layers.

3. Enables dopant activation and crystal damage repair after ion implantation.

4. Offers automated wafer handling with cleanroom-compatible design for contamination control.

5. Available in batch and rapid thermal processing (RTP) systems for high throughput production.

DESCRIPTION

Oxidation & Annealing Equipment are critical thermal processing systems used in the front-end of semiconductor fabrication to engineer the electrical and material properties of silicon wafers. These tools enable the controlled growth of oxide layers and precise heat treatment for dopant activation, defect repair, interface improvement, and material transformation all of which are essential for high-performance integrated circuits and devices.

PRODUCTS:
1. Horizontal & Vertical Oxidation/Annealing Furnaces
2. Rapid Thermal Processing (RTP) / Rapid Thermal Annealing (RTA) Systems
3. Integrated Oxidation–Annealing Platforms