The Fully Automatic Potting System for Power Modules is an ultrasonic scanning microscopy system used to detect internal defects in vehicle and power modules without damaging the product. Unlike surface-level inspection methods, this system relies on ultrasonic wave reflection to image internal structures, making it highly effective for identifying voids, cracks, and delamination beneath the module surface. The equipment is widely used in IGBT and power module manufacturing, where accurate defect localization, high scanning throughput, and reliable classification are essential for quality assurance.

Applicable Products: HPD, ED3, Econo, and other IGBT modules with pins or flat panel configurations