Wet Etching

1. High Throughput Processing: Suitable for batch processing of multiple wafers, ensuring efficient production flow.

2. Excellent Uniformity: Controlled temperature, chemical concentration, and agitation provide consistent etch rates across wafer surfaces.

3. Automated Chemical Control Systems: Precise monitoring of chemical composition, temperature, and process timing.

4. Multi-Tank Configuration: Integrated cleaning, rinsing (DI water), and drying modules in a single automated platform.

5. Cleanroom-Compatible & Safety Designed: Acid-resistant materials, chemical exhaust systems, and automated handling ensure safe and contamination-free operation.

DESCRIPTION

Wet etching equipment is a semiconductor process system used to remove selected materials from wafer surfaces using chemical liquid solutions (etchants). Unlike dry etching, wet etching relies purely on chemical reactions to dissolve exposed materials, making it highly effective for bulk material removal, surface cleaning, and isotropic etching applications in both front-end and back-end semiconductor manufacturing. Wet etching systems are widely used in wafer cleaning, oxide removal, metal etching, surface preparation, MEMS fabrication, and advanced packaging processes, where high throughput and uniformity are essential.

Types of Wet Etching Systems-
1. Batch Immersion Wet Benches
2. Single-Wafer Spray Etchers
3. Automated Inline Wet Processing Systems
4. Chemical Clean & Rinse Modules
5. Quartz Tank-Based Etching Systems