Wafer Preparation & Cleaning Equipment

1. Removes particles, organic films, and ionic contamination

2. Ensures adhesion and uniformity for downstream processes

3. Improves electrical performance and reliability of devices

4. Reduces defects and enhances overall fab yield

5. Constitutes multiple cleaning steps across the fab process flow

DESCRIPTION

In semiconductor front-end manufacturing, wafer preparation and cleaning is one of the most critical stages in ensuring high yield and device reliability. Before any high-precision process such as oxidation, deposition, etch, or lithography the wafer surface must be completely free of particles, organic contaminants, metal ions, and residues. Even nanometer-scale contamination can cause device defects or yield loss in modern ICs.

Products:
1. Batch Wet Cleaning Systems
2. Single-Wafer Cleaning Tools
3. Megasonic / Ultrasonic Cleaning Modules
4. Dry Cleaning & Plasma Conditioning Equipment