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Auto Wafer Inspection System

The Auto Wafer Inspection System supports loading and unloading through overhead crane, manual, or AGV, with optional 2 or 4 probes, real-time 3D scanning, AI defect identification, automatic data upload, and water removal for drying the sample.

DESCRIPTION

  • Loading & Unloading: Supports loading/unloading via overhead crane, manual, or AGV.
  • Probe Configuration: 2 probes or 4 probes are optional.
  • Sampling: Sampling rate: 4G.
  • Defect Resolution: Minimum defect resolution ≤3 μm.
  • Autofocus: Autofocus with real-time dynamic following.
  • Automatic Binding: Automatically binds/unbinds the product information.
  • 3D Inspection: Real-time 3D scanning with AI software to automatically identify defects and calculate defect size and proportion.
  • Data Management: Automatically saves data and uploads it to the MES system, compatible with SECS-II/GEM standard.
  • Water Removal: Equipped with a water removal system to dry the sample under test.
  • Manual Review: Buffers materials that need manual review.

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  • +91 80 41610311
  • info@asterionsemitech.com
  • Address: 1, Mahesh Building, Chamundeswari Layout, Doddabommasandra, Vidyaranyapura Main Road Bangalore - 560097

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